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Cooper Bussmann, Inc. L-07W5N6JV4T technical specifications, attributes, parameters and parts with similar specifications to Cooper Bussmann, Inc. L-07W5N6JV4T.
RF CERAMIC CHIP INDUCTORS | FIXED IND 10NH 250MA 450 MOHM
FIXED IND 18NH 200MA 650 MOHM
RF CERAMIC CHIP INDUCTORS | FIXED IND 1.5NH 300MA 130 MOHM
RF CERAMIC CHIP INDUCTORS | FIXED IND 2.4NH 300MA 160 MOHM
Inductor RF Chip Multi-Layer 0.0027uH 0.3nH 100MHz 8Q-Factor Ceramic 0.3A 0.17Ohm DCR 0402 T/R / RF CERAMIC CHIP INDUCTORS | FIXED IND 2.7NH 300MA 170 MOHM
Inductor RF Chip Multi-Layer 0.0033uH 0.3nH 100MHz 8Q-Factor Ceramic 0.3A 0.19Ohm DCR 0402 T/R / Chip and Wirewound Inductor Packaging Information Taping Specifications | FIXED IND 3.3NH 300MA 190 MOHM